Samsung is manufacturing massive 1 terabyte storage chips for smartphones

Samsung is manufacturing massive 1 terabyte storage chips for smartphones

If there is ever one thing we can’t ever have enough of in our smartphones, it’s storage space for the ton of pictures, videos, games and whatnot that accumulate over time. Now, Samsung has announced that it has begun mass production of the world’s first one-terabyte Universal Flash Storage (eUFS) 2.1 chips for inclusion in the next generation of smartphones.

That’s a massive step up in storage with sizes approaching what you’d expect in a conventional notebook in a form factor barely larger than a dime. Last year’s Samsung Galaxy Note9 offered one of the largest storage capacities available in a smartphone at 512GB of onboard storage and had a microSD card slot that allowed users to expand it up to one terabyte in total. The new eUFS 2.1 chips cram all of this storage capability into one compact form factor.

With 1 terabyte of storage in Samsung’s 1TB eUFS chips, a smartphone user can realistically expect to store 260 10-minute videos in luscious 4K UHD format and transfer 1,000 megabytes per second (MB/s) in data which is twice the sequential read speed of a normal 2.5-inch SATA solid state drive. The 1TB eUFS is expected to play a critical role in bringing a more notebook-like user experience to the next generation of mobile devices,” said Cheol Choi, executive vice president of Memory Sales & Marketing at Samsung Electronics. “What’s more, Samsung is committed to assuring the most reliable supply chain and adequate production quantities to support the timely launches of upcoming flagship smartphones in accelerating growth of the global mobile market.

It’s too early to tell of course but seeing as the Galaxy S10’s official debut is less than two weeks away, there is a possibility that Samsung’s next flagship phone may be the first recipient of their eUFS 2.1 1TB storage chips. For more details on the new 1TB eUFS 2.1 chips swing by Samsung’s official site here.

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